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WIRELESS CHIPSET APPLICATION ENGINEER
WIRELESS CHIPSET APPLICATION ENGINEER H1B Salary Data
FY2020 – FY2023 • 1 employers • Official DOL Data
$171K
Median Salary
6
Total Filings
$143K–$200K
Middle 50%
1
Employers
P10: $143K
P25: $143K
Median: $171K
P75: $200K
P90: $200K
Top Paying Companies
ROHDE & SCHWARZ USA, INC.
$171K
6 filings
Top Cities
San Diego, CA
$158K
38 filings
Milpitas, CA
$148K
35 filings
Columbia, MD
$141K
17 filings
Irvine, CA
$150K
16 filings
Hillsboro, OR
$138K
12 filings
Lynnwood, WA
$163K
4 filings
Marysville, WA
$157K
3 filings
Parker, CO
$150K
3 filings
Milpitas, CALIFORNIA
$160K
WIRELESS CHIPSET APPLICATION ENGINEER Salary Trend by Year
FY2020
$143K
1 filings
FY2021
$143K
3 filings
FY2023
$200K
2 filings
3 filings
Bellevue, WA
$148K
2 filings
WIRELESS CHIPSET APPLICATION ENGINEER H1B Salary 2023 — Median $171K, 6 Records | H1B Data | H1BData.us