H1B
Data
Companies
Job Titles
Top Sponsors
Salary Calculator
Top Cities
RF HARDWARE ENGINEER H1B Salary 2025 — Median $124K, 5 Records | H1B Data | H1BData.us
Home
→
Job Titles
→
RF HARDWARE ENGINEER
RF HARDWARE ENGINEER H1B Salary Data
FY2018 – FY2025 • 4 employers • Official DOL Data
$124K
Median Salary
5
Total Filings
$65K–$155K
Middle 50%
4
Employers
P10: $65K
P25: $65K
Median: $124K
P75: $155K
P90: $156K
Top Paying Companies
GOOGLE, LLC
$157K
1 filings
VERKADA, INC.
$155K
1 filings
TERADYNE, INC.
$124K
1 filings
ESDEMC TECHNOLOGY LLC
$65K
2 filings
Top Cities
Mountain View, CA
$179K
27,545 filings
Sunnyvale, CA
$156K
17,361 filings
New York, NY
$132K
6,659 filings
Mountain View, CALIFORNIA
$140K
4,285 filings
Kirkland, WA
$154K
3,678 filings
Seattle, WA
$151K
3,266 filings
San Francisco, CA
$166K
2,799 filings
San Bruno, CA
$157K
2,554 filings
RF HARDWARE ENGINEER Salary Trend by Year
FY2018
$124K
1 filings
FY2022
$65K
1 filings
FY2024
$157K
1 filings
FY2025
$110K
2 filings
Sunnyvale, CALIFORNIA
$142K
1,824 filings
Austin, TX
$151K
1,413 filings