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RF HARDWARE DESIGN ENGINEER H1B Salary Data

FY2020 – FY2023 • 3 employers • Official DOL Data

$123K

Median Salary

Total Filings

$110K–$123K

Middle 50%

Employers

P10: $109KP25: $110KMedian: $123KP75: $123KP90: $127K

Top Paying Companies

GENXCOMM, INC.

$123K

3 filings

TERADYNE, INC.

$110K

1 filings

RF-LAMBDA USA INC.

$109K

1 filings

Top Cities

North Reading, MA

$112K

105 filings

San Jose, CA

$132K

56 filings

Agoura Hills, CA

$112K

33 filings

Buffalo Grove, IL

$91K

17 filings

Fridley, MN

$90K

14 filings

Austin,, TX

$115K

14 filings

San Diego, CA

$79K

9 filings

North Reading, MASSACHUSETTS

$90K

9 filings

RF HARDWARE DESIGN ENGINEER Salary Trend by Year

FY2020

$109K

1 filings

FY2021

$123K

2 filings

FY2023

$120K

2 filings