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PRINCIPAL ENGINEER, FIRMWARE
PRINCIPAL ENGINEER, FIRMWARE H1B Salary Data
FY2015 – FY2025 • 6 employers • Official DOL Data
$134K
Median Salary
25
Total Filings
$120K–$165K
Middle 50%
6
Employers
P10: $112K
P25: $120K
Median: $134K
P75: $165K
P90: $187K
Top Paying Companies
SAMSUNG SEMICONDUCTOR, INC.
$208K
1 filings
SK HYNIX MEMORY SOLUTIONS AMERICA, INC.
$184K
3 filings
SK HYNIX MEMORY SOLUTIONS INC.
$173K
3 filings
CYPRESS SEMICONDUCTOR CORPORATION
$165K
1 filings
MICROCHIP TECHNOLOGY, INC.
$130K
14 filings
CALAMP WIRELESS NETWORKS CORPORATION
$127K
3 filings
Top Cities
San Jose, CA
$128K
1,775 filings
Chandler, AZ
$76K
789 filings
San Diego, CA
$121K
270 filings
San Jose, CALIFORNIA
$116K
179 filings
Austin, TX
$120K
138 filings
Colorado Springs, CO
$94K
112 filings
Lynnwood, WA
$114K
104 filings
Irvine, CA
$114K
71 filings
PRINCIPAL ENGINEER, FIRMWARE Salary Trend by Year
FY2015
$150K
1 filings
FY2017
$173K
1 filings
FY2018
$180K
2 filings
FY2019
$184K
3 filings
FY2020
$110K
1 filings
FY2022
$129K
5 filings
FY2023
Chandler, ARIZONA
$65K
64 filings
Carlsbad, CA
$92K
38 filings
$131K
4 filings
FY2024
$135K
2 filings
FY2025
$134K
6 filings
PRINCIPAL ENGINEER, FIRMWARE H1B Salary 2025 — Median $134K, 25 Records | H1B Data | H1BData.us