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PLATING PROCESS DEVELOPMENT ENGINEER
PLATING PROCESS DEVELOPMENT ENGINEER H1B Salary Data
FY2019 – FY2025 • 1 employers • Official DOL Data
$140K
Median Salary
6
Total Filings
$125K–$153K
Middle 50%
1
Employers
P10: $120K
P25: $125K
Median: $140K
P75: $153K
P90: $157K
Top Paying Companies
HEADWAY TECHNOLOGIES, INC.
$140K
6 filings
Top Cities
Milpitas, CA
$115K
191 filings
Milpitas, CALIFORNIA
$91K
5 filings
PLATING PROCESS DEVELOPMENT ENGINEER Salary Trend by Year
FY2019
$120K
1 filings
FY2022
$120K
1 filings
FY2023
$140K
1 filings
FY2024
$140K
1 filings
FY2025
$157K
2 filings
PLATING PROCESS DEVELOPMENT ENGINEER H1B Salary 2025 — Median $140K, 6 Records | H1B Data | H1BData.us