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MICROELECTRONICS PACKAGING ENGINEER H1B Salary Data

FY2021 – FY2025 • 1 employers • Official DOL Data

$95K

Median Salary

Total Filings

$95K–$100K

Middle 50%

Employers

P10: $92KP25: $95KMedian: $95KP75: $100KP90: $107K

Top Paying Companies

ALLEGRO MICROSYSTEMS, LLC

$95K

7 filings

Top Cities

Manchester, NH

$92K

131 filings

Marlborough, MA

$105K

17 filings

Worcester, MA

$101K

14 filings

Manchester, NEW HAMPSHIRE

$82K

5 filings

Richardson, TX

$120K

3 filings

Marlborough, MASSACHUSETTS

$90K

2 filings

Austin, TX

$96K

1 filings

Auburn Hills, MI

$145K

1 filings

MICROELECTRONICS PACKAGING ENGINEER Salary Trend by Year

FY2021

$98K

2 filings

FY2022

$91K

2 filings

FY2024

$106K

2 filings

FY2025

$100K

1 filings