H1B
Data
Companies
Job Titles
Top Sponsors
Salary Calculator
Top Cities
Home
→
Job Titles
→
HARDWARE ENGINEERING PROGRAM MANAGER
HARDWARE ENGINEERING PROGRAM MANAGER H1B Salary Data
FY2015 – FY2023 • 7 employers • Official DOL Data
$145K
Median Salary
38
Total Filings
$134K–$155K
Middle 50%
7
Employers
P10: $125K
P25: $134K
Median: $145K
P75: $155K
P90: $162K
Top Paying Companies
SQUARE, INC.
$171K
1 filings
RYZEN SOLUTIONS
$161K
1 filings
MICROSOFT CORPORATION
$145K
30 filings
APPLE, INC.
$140K
1 filings
MEDTRONIC, INC.
$139K
1 filings
JUICERO, INC.
$135K
2 filings
VERKADA, INC.
$135K
2 filings
Top Cities
Redmond, WA
$123K
50,516 filings
Cupertino,, CA
$161K
23,442 filings
Bellevue, WA
$162K
8,653 filings
Sunnyvale, CA
$136K
5,766 filings
Austin, TX
$147K
4,816 filings
Redmond, WASHINGTON
$139K
3,247 filings
Mountain View, CA
$135K
3,127 filings
Atlanta, GA
$134K
2,155 filings
HARDWARE ENGINEERING PROGRAM MANAGER Salary Trend by Year
FY2015
$126K
2 filings
FY2016
$161K
1 filings
FY2017
$135K
1 filings
FY2018
$135K
1 filings
FY2019
$138K
6 filings
FY2020
$135K
6 filings
FY2021
HARDWARE ENGINEERING PROGRAM MANAGER H1B Salary 2023 — Median $145K, 38 Records | H1B Data | H1BData.us
San Diego, CA
$133K
1,881 filings
San Francisco, CA
$141K
1,826 filings
$145K
13 filings
FY2022
$140K
7 filings
FY2023
$130K
1 filings