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ENGINEER II, FIRMWARE
ENGINEER II, FIRMWARE H1B Salary Data
FY2015 – FY2025 • 4 employers • Official DOL Data
$97K
Median Salary
9
Total Filings
$91K–$99K
Middle 50%
4
Employers
P10: $85K
P25: $91K
Median: $97K
P75: $99K
P90: $105K
Top Paying Companies
MICROCHIP TECHNOLOGY, INC.
$107K
2 filings
CALAMP WIRELESS NETWORKS CORPORATION
$95K
2 filings
VT IDIRECT, INC.
$94K
4 filings
DEXCOM, INC.
$61K
1 filings
Top Cities
Chandler, AZ
$76K
789 filings
San Diego, CA
$107K
416 filings
San Jose, CA
$115K
237 filings
Herndon, VA
$101K
129 filings
Chandler, ARIZONA
$65K
64 filings
Irvine, CA
$117K
52 filings
Colorado Springs, CO
$77K
50 filings
Austin, TX
$91K
49 filings
ENGINEER II, FIRMWARE Salary Trend by Year
FY2015
$92K
1 filings
FY2016
$91K
1 filings
FY2017
$61K
1 filings
FY2018
$98K
1 filings
FY2019
$97K
1 filings
FY2020
$99K
1 filings
FY2022
San Diego, CALIFORNIA
$97K
46 filings
Carlsbad, CA
$92K
38 filings
$97K
2 filings
FY2025
$110K
1 filings
ENGINEER II, FIRMWARE H1B Salary 2025 — Median $97K, 9 Records | H1B Data | H1BData.us