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ELECTROPLATING PROCESS ENGINEER
ELECTROPLATING PROCESS ENGINEER H1B Salary Data
FY2019 – FY2022 • 2 employers • Official DOL Data
$105K
Median Salary
5
Total Filings
$101K–$138K
Middle 50%
2
Employers
P10: $95K
P25: $101K
Median: $105K
P75: $138K
P90: $138K
Top Paying Companies
FORMFACTOR, INC.
$138K
3 filings
MICROFABRICA, INC.
$98K
2 filings
Top Cities
Livermore, CA
$119K
158 filings
Van Nuys, CA
$110K
22 filings
San Jose, CA
$106K
16 filings
Livermore, CALIFORNIA
$105K
14 filings
Beaverton, OR
$103K
13 filings
Carlsbad, CA
$91K
11 filings
San Jose, CALIFORNIA
$106K
6 filings
Overland Park, KS
$147K
2 filings
ELECTROPLATING PROCESS ENGINEER Salary Trend by Year
FY2019
$101K
1 filings
FY2020
$91K
1 filings
FY2021
$138K
2 filings
FY2022
$105K
1 filings
Beaverton, OREGON
$72K
2 filings
Baldwin Park, CA
$97K
2 filings
ELECTROPLATING PROCESS ENGINEER H1B Salary 2022 — Median $105K, 5 Records | H1B Data | H1BData.us