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COMPONENT RELEASE ENGINEER H1B Salary 2023 — Median $84K, 8 Records | H1B Data | H1BData.us
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COMPONENT RELEASE ENGINEER
COMPONENT RELEASE ENGINEER H1B Salary Data
FY2018 – FY2023 • 3 employers • Official DOL Data
$84K
Median Salary
8
Total Filings
$82K–$107K
Middle 50%
3
Employers
P10: $77K
P25: $82K
Median: $84K
P75: $107K
P90: $107K
Top Paying Companies
BORGWARNER TRANSMISSION PRODUCTS, LLC
$107K
3 filings
BORGWARNER PDS USA, INC.
$84K
3 filings
BORGWARNER PDS (ANDERSON), LLC
$77K
2 filings
Top Cities
Auburn Hills, MI
$112K
243 filings
Kokomo, IN
$94K
94 filings
Noblesville, IN
$102K
59 filings
Auburn Hills, MICHIGAN
$103K
20 filings
Seneca, SC
$94K
16 filings
Seneca, SOUTH CAROLINA
$88K
7 filings
Bellwood, IL
$114K
6 filings
Noblesville, INDIANA
$98K
5 filings
COMPONENT RELEASE ENGINEER Salary Trend by Year
FY2018
$84K
1 filings
FY2019
$84K
2 filings
FY2020
$77K
1 filings
FY2021
$107K
3 filings
FY2023
$77K
1 filings
Wauwatosa, WI
$93K
3 filings
Pendleton, IN
$99K
2 filings